Wet scrubbing system-AIRTECHS_Specializing in waste gas treatment engineering

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Wet scrubbing system

Release time:

2022-04-28

In the electronic semiconductor industry, acidic and alkaline waste gases originate from chemical cleaning stations. These gases are irritating and harmful to human health; therefore, the typical treatment method for acidic and alkaline waste gases involves using wet scrubbers to treat the gases with water before they are released into the atmosphere. Scrubbers utilize packed beds or wetted surfaces to remove particles larger than 0.1 micrometers. The gas-liquid contact modes in scrubbers include cross-flow (vertical cross-flow), co-current flow, and counter-current flow. As for the design of the liquid flow, there are four main types: nozzle type, spray type, neck-type, and Raschig-ring type. All waste gases generated during the production processes of semiconductor enterprises can be treated: ➢ Integrated circuit manufacturers: primarily include manufacturers of digital integrated circuits and analog integrated circuits. ➢ Discrete device manufacturers: mainly include manufacturers of crystal diodes, transistors, rectifier diodes, power diodes, compound diodes, and other discrete devices. ➢ Optoelectronic component manufacturers: include manufacturers of LEDs, OLEDs, LCDs, photovoltaic solar cells, and other optoelectronic components. Due to the extremely high cleanliness requirements for cleanrooms in semiconductor manufacturing processes, fans are typically used to extract various volatile waste gases generated during the process. Consequently, waste gas emissions from the semiconductor industry are characterized by large volumes but low concentrations. Most of these emissions are in the form of volatiles. Compared to semiconductor fabrication processes, waste gases generated during semiconductor packaging processes are relatively simpler, consisting mainly of acidic gases, epoxy resins, and dust. Acidic waste gases primarily originate from processes such as electroplating; baking emissions come from the baking steps following wafer bonding and sealing; and dicing machines produce waste gases containing trace amounts of silicon dust during the wafer-cutting process.

Waste gases generated during the production processes of semiconductor enterprises can all be treated: ➢ Integrated circuit manufacturers: primarily include companies that produce digital integrated circuit boards and analog integrated circuit boards. ➢ Discrete device manufacturers: primarily include companies that manufacture and produce discrete components such as crystal diodes, transistors, rectifier diodes, power diodes, and compound diodes. ➢ Optoelectronic component manufacturers: include companies that produce and manufacture LEDs, OLEDs, LCDs, photovoltaic solar cells, and other optoelectronic devices.

Due to the extremely high cleanliness requirements of semiconductor manufacturing processes, fans are typically used to extract various volatile gases generated during the process. As a result, waste gas emissions from the semiconductor industry are characterized by large volumetric flow rates and low emission concentrations. Moreover, these waste gases are predominantly emitted in a volatile form. Compared to semiconductor fabrication processes, the waste gases produced by semiconductor packaging processes are relatively simpler, consisting mainly of acidic gases, epoxy resins, and particulate matter. Acidic waste gases primarily originate from processes such as electroplating; baking waste gases are generated during the post-gluing and sealing baking steps following wafer bonding; and dicing machines produce waste gases containing trace amounts of silicon dust during the wafer-cutting process.