Solution

VOCs Exhaust Gas Treatment System


1. For large-volume, low-concentration VOCs, a rotary concentrator combined with an RTO treatment process is employed, achieving a removal rate of 85% to 99%. 2. Removal Principle: The rotary concentrator consists of a treatment zone, a desorption and regeneration zone, and a cooling zone. The rotor continuously rotates through these zones. Before entering the rotary concentrator, the VOC-containing exhaust gas is first passed through a pre-filter. In the treatment zone, the adsorbent removes the VOCs; in the regeneration zone, the adsorbed VOCs are desorbed at high temperatures. The air from the cooling zone is then reheated and used as regeneration air.
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Fireproof And Corrosion-Resistant Duct System


Suzhou Aites Environmental Protection Equipment Co., Ltd. was established in 2002 and specializes in exhaust gas treatment projects. It is a modern enterprise integrating R&D, design, and service. The company primarily deals in exhaust gas treatment systems, FRP scrubbing towers, FRP tanks and vessels, as well as various FRP piping products. To date, the company holds 57 national patents (including 1 invention patent), of which 5 have been granted and 11 are currently under review (9 of these are invention patents). Thanks to their outstanding features—such as high-temperature resistance, corrosion resistance, strong environmental adaptability, high efficiency, low vibration, and low noise—the company’s products have become the preferred choice for industrial enterprises’ exhaust gas purification and emission control systems.
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Wet Electrostatic Precipitation (Demisting) System


In a wet electrostatic precipitator, water mist causes dust particles to coalesce and become charged together with the dust in the electric field, after which they are collected together. The water mist collected on the electrode plates forms a water film, which helps clean the electrodes and keeps them free from dust buildup. Meanwhile, as the flue gas temperature drops and its moisture content increases, the specific resistivity of the dust significantly decreases, ensuring that the wet electrostatic precipitator operates in a highly stable condition. The working principle of WESP technology: A high-voltage DC potential of tens of thousands of volts is applied between the anode plates (or cylinders) and the cathode wires of the demister. Under the influence of the strong electric field, the gas between the anode and cathode undergoes thorough ionization, filling the demister space with ions carrying both positive and negative charges. As the process gas flow enters the demister, dust (or mist) particles collide with these positive and negative ions and become charged themselves. The charged dust (or mist) particles, driven by the Coulomb force generated by the high-voltage electrostatic field, move toward the anode and cathode respectively. Upon reaching the electrodes, they release their respective charges. Meanwhile, the dust (or mist) particles themselves, due to their inherent viscosity, adhere to the anode plates (or cylinders) and cathode wires, and are subsequently removed through a fluid-cleaning process.
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Wet scrubbing system


In the electronic semiconductor industry, acidic and alkaline waste gases originate from chemical cleaning stations. These gases are irritating and harmful to human health; therefore, the typical treatment method for acidic and alkaline waste gases involves using wet scrubbers to treat the gases with water before they are released into the atmosphere. Scrubbers utilize packed beds or wetted surfaces to remove particles larger than 0.1 micrometers. The gas-liquid contact modes in scrubbers include cross-flow (vertical cross-flow), co-current flow, and counter-current flow. As for the design of the liquid flow, there are four main types: nozzle type, spray type, neck-type, and Raschig-ring type. All waste gases generated during the production processes of semiconductor enterprises can be treated: ➢ Integrated circuit manufacturers: primarily include manufacturers of digital integrated circuits and analog integrated circuits. ➢ Discrete device manufacturers: mainly include manufacturers of crystal diodes, transistors, rectifier diodes, power diodes, compound diodes, and other discrete devices. ➢ Optoelectronic component manufacturers: include manufacturers of LEDs, OLEDs, LCDs, photovoltaic solar cells, and other optoelectronic components. Due to the extremely high cleanliness requirements for cleanrooms in semiconductor manufacturing processes, fans are typically used to extract various volatile waste gases generated during the process. Consequently, waste gas emissions from the semiconductor industry are characterized by large volumes but low concentrations. Most of these emissions are in the form of volatiles. Compared to semiconductor fabrication processes, waste gases generated during semiconductor packaging processes are relatively simpler, consisting mainly of acidic gases, epoxy resins, and dust. Acidic waste gases primarily originate from processes such as electroplating; baking emissions come from the baking steps following wafer bonding and sealing; and dicing machines produce waste gases containing trace amounts of silicon dust during the wafer-cutting process.
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Wastewater Ammonia Removal Treatment System


The ammonia-nitrogen treatment system integrates multiple technologies, including ammonia stripping and absorption tower purification, to treat wastewater containing ammonia-nitrogen at varying concentrations. It can reduce the ammonia-nitrogen concentration in wastewater exceeding 10,000 mg/L to meet discharge standards. After treatment, the ammonia-nitrogen concentration is reduced to below 15 mg/L. This system combines simplicity of operation, low investment, mature technology, convenient control, and zero secondary pollution—a combination that makes it highly effective. Traditionally, ammonia gas released during ammonia-nitrogen stripping would enter the atmosphere along with air, still posing a risk of secondary pollution. To address this issue, our company has added an absorption tower after the ammonia-stripping tower, ensuring that the air discharged into the atmosphere is thoroughly purified and free from any pollutants. Design Principle Explanation: In wastewater, ammonia-nitrogen primarily exists in two forms: ammonium ions (NH4+) and free ammonia (NH3). The equilibrium relationship between these two forms is as follows: NH3 + H2O ⇌ NH4+ + OH-. This equilibrium is influenced by pH value. When the pH is high, the equilibrium shifts to the left, increasing the proportion of free ammonia. At room temperature, when the pH is around 7, most of the ammonia-nitrogen exists in the form of ammonium ions; however, when the pH reaches approximately 11, free ammonia accounts for roughly 98%. Free ammonia readily escapes from water, and if the wastewater is aerated, this process is further enhanced, facilitating the release of ammonia from the water.
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